Supermicro System SSG-6029P-E1CR12T 2U Xeon LGA 3647 12 Hot-swap 3.5 inch SAS3/SATA3 Brown Box
| Status: | Available |
| SKU: | 213784 |
| Vendor: | Supermicro |
| MPN: | SSG-6029P-E1CR12T |
| UPC: | 672042287482 |
| EAN: | |
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This CPU heat sink is designed for Supermicro X11DPL-i motherboard with 2U and above chassis equipped with Intel® Xeon® scalable processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance. Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller) 4. 12 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%) |
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| Processor/Cache CPU: - Dual Socket P (LGA 3647) - Intel Xeon Scalable Processors, 3 UPI up to 10.4GT/s - Support CPU TDP 70-205W Cores: Up to 28 Cores with Intel HT Technology |
System Memory Memory Capacity: - 16 DIMM slots - Up to 2TB ECC 3DS LRDIMM, 512GB ECC RDIMM, DDR4 up to 2666MHz Memory Type: 2666/2400/2133MHz ECC DDR4 SDRAM |